Chinese technology company Huawei has claimed a major breakthrough in semiconductor technology despite US sanctions and global pressure. The company announced that by 2031 it aims to achieve the capability of producing high-end chips with transistor density equivalent to a 1.4 nanometer process.

According to Huawei the company has introduced a new principle for chip designing called ‘Tau Scaling Law’. The company says the global semiconductor industry has now reached a stage where simply making transistors smaller is no longer enough and a new technical strategy is needed.

The important announcement was made during the 2026 IEEE International Symposium on Circuits and Systems ‘ISCAS’ held in Shanghai. During the event Huawei Semiconductor Business President and Director of the Scientist Committee He Tingbo delivered a speech titled ‘New Semiconductor Path in Practice’ and explained the company’s new chip strategy in detail.

It should be noted that if Huawei succeeds in achieving its target this development will be considered a major change in the global chip industry because 1.4 nanometer technology is expected to be among the world’s most advanced technologies by the end of the next decade.

It is important to remember that over the past few years the United States has imposed strict restrictions on the supply of advanced lithography machines semiconductor equipment and other sensitive technologies to China. These restrictions are aimed at limiting China’s advanced chip manufacturing capabilities.

Despite this situation Huawei through its new strategy has tried to send a message that the company is focusing on improving chip performance through new technologies instead of relying only on traditional manufacturing methods.

According to the company the main objective of the Tau Scaling Law is to reduce the time required for signals and data transfer inside chips so that higher speed and better performance can be achieved with limited resources. Huawei says this approach can significantly improve overall chip capability despite restricted access to advanced equipment.

Huawei also revealed that the Kirin chips expected to be introduced by the end of 2026 will use a new architecture called ‘Logic Folding’ for the first time. This technology will reduce wiring distance inside the chips improve data transfer speed and deliver better performance with lower energy consumption.

The company claimed that during the past six years 381 different chips based on the Tau Scaling Law have already been designed and mass produced. These chips are being used in smartphones artificial intelligence AI cloud computing and other advanced technology sectors.

If Huawei succeeds in its plan this will not only be a major success for China’s semiconductor industry but could also give a new direction to the ongoing technology competition between the United States and China in the global chip market.